AI’s Memory Crisis Is Here: Don’t Hoard, Optimize

The GPUs powering today's models carry limited high-bandwidth memory (HBM) before external memory is required—that's the ...
IEEE

Advanced Packaging Road Map to 2030: Integrating Memory, Logic, and Systems for Artificial Intelligence

Abstract: The exponential growth of artificial intelligence (AI) and high-performance computing (HPC) is driving a paradigm shift in semiconductor design, where advanced packaging has become a ...
Tech Xplore

Hybrid AI architecture could turn neuromorphic systems into reliable discovery machines

The artificial intelligence (AI) machines that guide the world can be grouped into three main categories: inference machines, ...
Network World

HPE memory server targets compute-heavy and agentic AI workloads

The 64TB HPE Compute Scale-up Server 3250 is built with Intel Xeon 6 processors and features a modular architecture suited ...
IEEE

TRIO-TCAM: An Area and Energy-Efficient Triple-State-in-Cell Ternary Content-Addressable Memory Architecture

Abstract: Ternary content-addressable memory (TCAM) is critical for applications requiring high-speed data retrieval and pattern matching, such as networking, cybersecurity, artificial intelligence, ...