Abstract: We propose a largely output-sensitive visualization method for 3D line integral convolution (LIC) whose rendering speed is mainly independent of the data set size and mostly governed by the ...
Abstract: In this paper, we present an implementation of a thermal modeling method, based on thermal impedances analysis and applied to a multichip module used as a power converter. Analytical ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results