IEEE

Image-Based Accelerated Prediction of Thermal Properties of Package Substrates Using Combined Deep-Learning and an Enhanced Thermal Network Model

Abstract: As the need for processing large amounts of data increases, power consumption and the complexity of semiconductor package patterns also rise, making thermal management crucial. Traditional ...
IEEE

Momentum-Accelerated Online Learning: Parameter-Learning Momentum Neurodynamic for Dynamic Linear Equations

In this paper, a parameter-learning momentum neurodynamic (PL-MND) model is proposed for dynamic linear equations (DLEs). The PL-MND model constructs an innovat ...