Filtronic, the RF and mmWave specialist, has enhanced its hybrid and semiconductor packaging capabilities by investing in a fully automated wedge bonder. Suitable for power semiconductors, automotive ...

Wire bonding, a critical yet often overlooked process in electronics manufacturing, plays an indispensable role in shaping the devices we rely on today. A programmable semi-automatic ultrasonic wire ...

QP Technologies can create secure aluminum wedge bonds, like those shown in this microscopic image, for RF, power and mil-aero device packages using its Hesse Mechatronics bonders. ESCONDIDO, Calif., ...

New generations of small medical electronics devices demand the highest levels of quality and reliability For EMS providers and contract manufacturers, the International Standards Organization (ISO) ...