Charlotte, N.C., Feb. 01, 2021 (GLOBE NEWSWIRE) -- Akoustis Technologies, Inc. (NASDAQ: AKTS) (“Akoustis” or the “Company”), an integrated device manufacturer (IDM) of patented bulk acoustic wave (BAW ...
Imec and EV Group (EVG) demonstrate a highly yielding wafer-to-wafer hybrid bonding technology at 200nm Cu interconnect pad ...
How a real chip-last process flow with a chip-to-wafer (C2W) bonding technology can address the RDL-base Interposer PoP challenge. Fan-Out Wafer-Level Interposer Package-on Package (PoP) design has ...
Through their continued collaboration, Imec and EV Group (EVG) are focusing on advancing the overlay performance required for advanced logic-to-logic and memory-to-logic tier stacking. Imec and EV ...
Unpatterned wafer inspection, which has flown well under the radar for most of the semiconductor industry, is becoming more critical amid the need to find defects earlier in the manufacturing process ...
Nordson MARCH Addresses the Ways Plasma Treatment during Fan-out Wafer and Fan-out Panel-Level Semiconductor Packaging Maximizes Performance and Optimizes Costs In recent years, there has been an ...
To support McCrometer’s European customers, the high-accuracy, virtually no-maintenance Wafer-Cone Flow Meter meets the requirements of the European Community’s Pressure Equipment Directive (PED) ...
Wafer-to-wafer hybrid bonding process capable of achieving a 200-nanometre copper interconnect pitch demonstrated.
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