Samsung 900-layer NAND prototype — the world’s first — uses Cell Multi-Bonding to fuse two 450-layer wafers into one chip, ...

PCB Signal integrity & Stackup design. Ever more complex PCB designs require layer stackups to be considered even before you layout the design. As a designer there are now vast choices of base ...

A frequently asked question during Printed Circuit Board (PCB) layout review meetings is, “Are 50-ohm traces being used for the digital signals in this PCB layout?” Often the answer to this question ...

Once a printed circuit board (PCB) has been assembled it’s rather hard to look inside of it, which can be problematic when you have e.g. a multilayer PCB of an (old) system that you really would like ...

In recent months, the ability to hide components inside a circuit board has become an item of interest. We could trace this to the burgeoning badgelife movement, where engineers create beautiful works ...

This is the first of several articles in the PCB Design Best Practices series, which discusses the different steps of PCB development from the basics of creating a design schematic with specific ...

What is reverse engineering? Tools used to reverse engineer a PCB. Specifics about de-layering Printed-circuit-board (PCB) reverse engineering is a method of analyzing and understanding the design ...

What is software defined radio (SDR) and how does it benefit modern communications and RF applications? RF/microwave PCB design for Radar and SDRs. Challenges of SDR PCB design and ways to overcome ...

Thermal challenges in 3D-IC designs can cause a significant risk in meeting performance specifications. While the pace of Moore’s Law has slowed in recent years, system technology co-optimization ...