BGA soldering is very reliable if done using the correct procedure, so we introduce GA Soldering on PCB board, BGA Inspection and BGA Rework. According to different packaging materials, BGA components ...

The ball grid array (BGA) is a surface-mount chip package that is used to mount embedded devices (e.g. microprocessors) by melting balls of solder between the face of the device and the circuit board.

Users can socket their 1mm pitch, 64ball BGA devices without performance loss or little board space, no mounting holes, no solder EAGAN, MN—Ironwood Electronics' new high-performance ...