Texas A&M University researchers have discovered that when charging a supercapacitor, it stores energy and responds by stretching and expanding. This finding can be used to design new materials for ...

Thermal and mechanical stresses are creating significant challenges in heterogeneous chiplet assemblies, increasing the time and cost required to work through all the possible physical effects, ...

The semiconductor industry is undergoing a transformation as 3D integrated circuits (ICs) and heterogeneous packaging become mainstream. With these advances comes the promise of higher functional ...

Our body consists of ~30 trillion cells. These cells need to tightly attach to each other to maintain the integrity of our body. However, we are constantly exposed to mechanical stress, which ...

Immersion cooling is changing how designers address thermal issues in data centers. Formalizing standards and expanding testing capabilities are still needed to streamline component validation and ...