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AMD UALink strategy: Can AMD disrupt AI data center dominance as open interconnect challenges NVIDIA NVLink ecosystem control?

The rise of AI infrastructure is accelerating fast, and AMD UALink Standard is now at the center of this shift. With Advanced Micro Devices taking a leadership role in the newly ratified UALink ...
Business Wire

ASE’s VIPack™ Enables Innovational AI Devices Through Advanced Interconnect Technology for Chiplets

SUNNYVALE, Calif.--(BUSINESS WIRE)--Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. (NYSE: ASX) (TAIEX: 3711), today announced that it has extended its ...
TMCnet

Palomino Laboratories Inc. Ships First Generation MicroLED Light Engine Prototypes to First Hyperscaler Customer

First Customer evaluates prototypes and confirms the MicroLED bandwidth performance exceeded the Company’s measured data. (ii) Company expects to sample 2 nd generation MicroLED technology to multiple ...
Ars Technica

Tech giants form AI group to counter Nvidia with new interconnect standard

On Thursday, several major tech companies, including Google, Intel, Microsoft, Meta, AMD, Hewlett-Packard Enterprise, Cisco, and Broadcom, announced the formation of the Ultra Accelerator Link (UALink ...

Fabric.AI (Nasdaq: FABC) Stockholders Ratify Kopin Strategic Partnership to Develop Neural I/o™ MicroLED Optical Interconnect Technology for Next Generation AI Data Centers

Company advances development of its MicroLED-based interconnect technology to address the growing demands of high-performance computing and reaffirms its strategic priorities How the Neural I/o ...
Seeking Alpha

Industry First: Single-Device Interconnect Isolation Solution for Critical Power Sustainability

ASCO Power Technologies unveils a single-device solution to streamline BESS deployment for backup applications. FLORHAM PARK, N.J., Jan. 23, 2024 /PRNewswire/ -- Battery Energy Storage Systems (BESS) ...
TMCnet

Palomino Laboratories Announces Binding LOI to Acquire Vega Links Inc. to Create a Next-Generation AI Interconnect Company

Transforms Palomino beyond MicroLED optical interconnects into a comprehensive AI interconnect company spanning copper, MicroVCSEL and MicroLED data co ...
Business Wire

Insights on the Global Molded Interconnect Device (MID) Market 2020-2024 | COVID-19 Analysis, Drivers, Restraints, Opportunities and Threats | Technavio

LONDON--(BUSINESS WIRE)--Technavio has been monitoring the molded interconnect device (MID) market and it is poised to grow by USD 862.93 million during 2020-2024, progressing at a CAGR of over 12% ...
Computerworld

PCI building thinner interconnect for handheld devices

The PCI-Express standards-setting organization is creating a thin interconnect that would link mobile devices such as smartphones and tablets to external peripherals, the organization’s chief said on ...
Science Daily

Device enables direct communication among multiple quantum processors

Researchers developed a scalable interconnect that facilitates all-to-all communication among many quantum processor modules by enabling each to send and receive quantum information on demand in a ...
Semiconductor Engineering

A review of interconnect materials used in emerging memory device packaging: first- and second-level interconnect materials

“The main motivation of this review is to study the evolution of first and second level of interconnect materials used in memory device semiconductor packaging. Evolutions of bonding wires from gold ...
EurekAlert!

Study compares techniques for doping graphene for device and interconnect fabrication

Nanotechnology researchers at the Georgia Institute of Technology have conducted the first direct comparison of two fundamental techniques that could be used for chemically doping sheets of ...