SANTA CLARA, Calif.–Applied Materials Inc. today announced a new silicon etch chamber for 200- and 300-mm wafer DRAM fabs needing deep-trench etching technology for 100-nm and below process geometries ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--Dec. 6, 2005--Applied Materials, Inc. today announced the Applied Centura(R) AdvantEdge(TM) Metal Etch, the most advanced system ...

New research paper entitled “Plasma-based area selective deposition for extreme ultraviolet resist defectivity reduction and process window improvement” from TEL Technology Center, Americas and IBM ...

Applied Materials Inc. says it can do away with the middle etch stop layer in copper dual damascene/low k stacks and provide better critical dimension (CD) control with its new EnTek Centura chamber.

FREMONT, Calif., March 03, 2020 (GLOBE NEWSWIRE) -- Lam Research Corp. (Nasdaq: LRCX) today announced the launch of a completely transformed plasma etch technology and system solution, designed to ...

New Centris(TM) Sym3(TM) Etch system`s innovative chamber architecture enables precision removal of materials to the atomic level Already installed as a production tool of record with multiple ...

A team of physicists has uncovered some of the physics that make possible the etching of silicon computer chips, which power cell phones, computers, and a huge range of electronic devices. Physicist ...

Chipmakers are ramping up a new range of device architectures, such as 3D NAND and finFETs. But to enable current and future devices, IC vendors will require new breakthroughs, including tools that ...

MILPITAS, USA: KLA-Tencor released its next-generation in-situ plasma etch wafer temperature measurement product, the EtchTemp SensorWafer. This SensorWafer from KLA-Tencor’s SensArray division, ...

Physicist Igor Kaganovich at the Department of Energy's (DOE) Princeton Plasma Physics Laboratory (PPPL) and collaborators have uncovered some of the physics that make possible the etching of silicon ...